K4S640832N Datasheet, PDF (14/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
96Ball FBGA (for DDR3 2Gb x16 B-die)
#A1
9.00 ± 0.10
TOP VIEW
Units : Millimeters
9.00 ± 0.10
0.80 x 8 = 6.40
0.80 1.60
3.20
987654321
A
#A1 INDEX MARK
B
0.35 ± 0.05
1.10 ± 0.10
A
(Datum A) _B
C
D
(Datum B) E
F
G
H
J
K
L
M
N
P
R
T
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
(0.95)
(1.90)
BOTTOM VIEW
MOLDING AREA
136Ball FBGA (for GDDR3 1Gb E-die)
#A1
10.00 ± 0.10
TOP VIEW
Units : Millimeters
0.35 ± 0.05
1.10 ± 0.10
10.00 ± 0.10
0.80 x 11 = 8.80
4.40
0.80
2.00
12 11 10 9 8 7 6 5 4 3 2 1
A
# A1 INDEX MARK
B
(Datum A) A
B
C
D
(Datum B) _E
F
G
H
J
K
L
M
N
P
R
T
V
136-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
0.95
1.90
MOLDING AREA
BOTTOM VIEW
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