K4S640832N Datasheet, PDF (2/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
1. CONSUMER MEMORY ORDERING INFORMATION
12 3
4
5
6 78
9 10 11
K4 XXXXXXXX-XXXX
SAMSUNG Memory
DRAM
Product
Density & Refresh
Organization
1. SAMSUNG Memory : K
2. DRAM : 4
3. Product
S : SDRAM
H : DDR SDRAM
T : DDR2 SDRAM
B : DDR3 SDRAM
D : GDDR
J : GDDR3
4. Density & Refresh
64 : 64Mb, 4K/64ms
28 : 128Mb, 4K/64ms
56 : 256Mb, 8K/64ms
51 : 512Mb, 8K/64ms
1G : 1Gb, 8K/64ms
2G : 2Gb, 8K/64ms
10 : 1Gb, 8K/32ms
5. Organization
04 : x4
08 : x8
16 : x16
32 : x32
31 : x32 (2CS)
6. Bank
2 : 2 Banks
3 : 4 Banks
4 : 8 Banks
Speed
Temperature & Power
Package Type
Revision
Interface (VDD, VDDQ)
Bank
7. Interface ( VDD, VDDQ)
2 : LVTTL (3.3V, 3.3V)
8 : SSTL_2 (2.5V, 2.5V)
Q : SSTL_18 (1.8V, 1.8V)
6 : SSTL_15 (1.5V, 1.5V)
K : POD_18 (1.8V, 1.8V)
8. Revision
M : 1st Gen.
A : 2nd Gen.
B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen.
G : 8th Gen.
H : 9th Gen.
I : 10th Gen.
J : 11th Gen.
K : 12th Gen.
L : 13th Gen.
N : 14th Gen.
O : 15th Gen.
S : 19th Gen.
9. Package Type
U
:
TSOPII (Lead-free)
100TQFP(Lead-free)
only
for
128Mb
GDDR
Z : FBGA (Lead-free)
V : 144FBGA (Lead-free) only for 128Mb GDDR
L : TSOPII (Lead-free & Halogen-free)
H : FBGA (Lead-free & Halogen-free)
F : FBGA(Lead-free & Halogen-free) for 64Mb DDR, 128Mb GDDR
M : FBGA DDP (Lead-free & Halogen-free)
B : FBGA FLIP-CHIP (Lead-free & Halogen-free)
10. Temperature & Power
C : Commercial Temp. & Normal Power
L : Commercial Temp. & Low Power
I : Industrial Temp. & Normal Power
P : Industrial Temp. & Low Power
D : Industrial Temp. & Super Low Power
Q : Commercial Temp. DDR3+ (Gapless, BL4)
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