K4S640832N Datasheet, PDF (11/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
60Ball FBGA (for DDR2 1Gb F-die x8)
Units : Millimeters
7.50 ± 0.10
#A1
TOP VIEW
0.37±0.05
1.10±0.10
(Datum A)
A
(Datum B) ^B
C
D
E
F
G
H
J
K
L
60-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
7.50 ± 0.10
0.80 x 8 = 6. 40
3.20
0.80
1.60
987654321
A
# A1 INDEX MARK
B
(0.30)
MOLDING AREA
(0.60)
BOTTOM VIEW
84Ball FBGA (for DDR2 1Gb F-die x16)
Units : Millimeters
7.50 ± 0.10
#A1
TOP VIEW
0.37±0.05
(Datum A)
A
B
C
D
(Datum B)
E
F
G
H
J
K
L
M
N
P
R
1.10±0.10
84-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
7.50 ± 0.10
0.80 x 8 = 6. 40
3.20
0.80
1.60
987654321
A
# A1 INDEX MARK
B
(0.30)
(0.60)
MOLDING AREA
BOTTOM VIEW
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