K4S640832N Datasheet, PDF (13/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
96Ball FBGA (for DDR3 1Gb x16 E-die / DDR3+ 1Gb x16 E-die / DDR3 2Gb x16 C-die)
Units : Millimeters
7.50 ± 0.10
A
#A1
7.50 ± 0.10
TOP VIEW
0.35 ± 0.05
1.10 ± 0.10
0.80 _1.60
3.20
987654321
#A1 INDEX MARK
B
A
(Datum A)
B
C
D
(Datum B)
E
F
G
H
J
K
L
M
N
P
R
T
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
(0.95)
(1.90)
MOLDING AREA
BOTTOM VIEW
78Ball FBGA (for DDR3 2Gb x8 B-die)
Units : Millimeters
#A1
9.00 ± 0.10
TOP VIEW
0.35 ± 0.05
1.10 ± 0.10
(Datum A)
9.00 ± 0.10
0.80 x 8 = 6.40
0.80 _1.60
3.20
A
#A1 INDEX MARK
B
987654321
A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
(0.95)
(1.90)
MOLDING AREA
BOTTOM VIEW
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