K4S640832N Datasheet, PDF (6/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
2.6 GDDR SDRAM
Density
Banks
Package & Power,
Part Number
Temp. (-C/-L) & Speed
Org.
FC40/50
Interface Refresh
128Mb K-die 4Banks K4D263238K VC40/50
4M x 32
SSTL_2 4K/32m
U^*1C40/50
NOTE : 1. 128Mb K-die GDDR TQFP supports Lead-free & Halogen-free package with Lead-free package code(-U)
Power (V)
2.5V±5%
PKG
Avail.
Lead-free & Halogen-
free
144ball FBGA
Lead-free
144ball FBGA
Lead-free & Halogen-
free
100pin TQFP^*1
3Q. ’10
EOL
2.7 GDDR3 SDRAM
Density
1Gb E-die
Banks
8Banks
Part Number
K4J10324KE
Package & Power,
Temp. (-C/-L) & Speed
HC7A/08/1A/12/14
Org.
32M x 32
Interface Refresh Power (V)
SSTL_2 8K/32m 1.8V±0.1V
PKG
136ball FBGA
Avail.
Now
-6-