K4S640832N Datasheet, PDF (7/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
3. Industrial Temperature Consumer DRAM Component Product Guide
3.1 SDRAM
Density
Bank
Part Number
Package & Power,
Temp. & Speed
Org.
Interface Refresh Power (V)
64Mb N-die 4Banks KS641632N
LI(P)60/I(P)75
4M x 16
LVTTL 4K/64ms 3.3±0.3V
128Mb K-die 4Banks K4S281632K
U^*1I(P)60/I(P)75
8M x 16
LVTTL 4K/64ms 3.3±0.3V
128Mb O-die 4Banks K4S281632O
LI(P)60/I(P)75
8M x 16
LVTTL 4K/64ms 3.3±0.3V
256Mb J-die 4Banks K4S561632J
U^*1I(P)60/I(P)75
16M x 16
LVTTL 8K/64ms 3.3±0.3V
256Mb N-die 4Banks K4S561632N
LI(P)60/I(P)75
16M x 16
LVTTL 8K/64ms 3.3±0.3V
NOTE : 1. 128Mb K-die SDR and 256Mb J-die SDR DRAMs support Lead-free & Halogen-free package with Lead-free package code(-U)
Package
54pin TSOP(II)
54pin TSOP(II)^*1
54pin TSOP(II)
54pin TSOP(II)^*1
54pin TSOP(II)
Avail.
Now
Now
3Q ’10
Now
2Q ’10
3.2 DDR SDRAM
Density
Bank
Part Number
512Mb F-die
K4H510838F
4Banks
K4H511638F
512Mb G-die 4Banks K4H511638G
Package & Power,
Temp. & Speed
LI(P)B3
LI(P)B3
HI(P)B3
LI(P)CC/B3
HI(P)CC/B3
NOTE : 1. V_DD/V_DDQ SPEC for 256/512Mb DDR
DDR400
DDR333/266
V_DD/V_DDQ
2.6V ± 0.1V
2.5V ± 0.2V
Org.
64M x 8
32M x 16
Interface
SSTL_2
Refresh Power (V)
8K/64m _2.5±0.2V^*1
32M x 16 SSTL_2 8K/64m 2.5±0.2V^*1
Package
66pinTSOPII
66pinTSOPII
60ball FBGA
66pinTSOPII
60ball FBGA
Avail.
Now
Now
3.3 DDR2 SDRAM
Density
Bank
Part Number
512Mb G-die
512Mb I-die
1Gb E-die
1Gb F-die
4Banks
4Banks
8Banks
8Banks
K4T51163QG
K4T51163QG
K4T51163QI
K4T51163QI
K4T1G084QE
K4T1G164QE
K4T1G084QF
K4T1G164QF
Package & Power,
Temp. & Speed
HI(P)F7/I(P)E6/I(P)D5/
I(P)CC
HDE6
HI(P)E7/I(P)F7/I(P)E6
HDE7/E6
HI(P)F7/I(P)E6
HI(P)F7/I(P)E6
BI(P)F7/I(P)E6
BI(P)F7/I(P)E6
Org.
32M x 16
32M x 16
128M x 8
64M x 16
128M x 8
64M x 16
Interface
SSTL_18
SSTL_18
SSTL_18
SSTL_18
Refresh Power (V)
8K/64m 1.8V±0.1V
8K/64m 1.8V±0.1V
8K/64m 1.8V ± 0.1V
8K/64m 1.8V ± 0.1V
Package
84ball FBGA
84ball FBGA
60ball FBGA
84ball FBGA
60ball FBGA
84ball FBGA
Avail.
Now
Now
Now
Now
2Q ’10
3.4 DDR3 SDRAM
Density
1Gb E-die
2Gb B-die
2Gb C-die
Bank
Part Number
8Banks K4B1G1646E
8Banks K4B2G1646B
8Banks K4B2G1646C
Package & Power,
Temp. & Speed
HI(P)H9
HI(P)H9
HI(P)H9
Org.
64M x 16
128M x 16
128M x 16
Interface
SSTL_15
SSTL_15
SSTL_15
Refresh Power (V)
8K/64m
8K/64m
8K/64m
1.5V±0.075V
1.5V±0.075V
1.5V±0.075V
Package
96ball FBGA
96ball FBGA
96ball FBGA
Avail.
Now
Now
2Q ’10
-7-