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| K4R761869A-F Datasheet, PDF (4/20 Pages) Samsung semiconductor – 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM | |||
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K4R761869A
Direct RDRAMâ¢
Pinouts and Definitions
Center-Bonded Devices
These tables shows the pin assignments of the center-bonded
RDRAM package. The mechanical dimensions of this
package are shown in a later section. Refer to Section
âCenter-Bonded WBGA Packageâ on page 18. Note - pin #1
is at the A1 position.
Table 1: Center-Bonded Device (top view)
10
VDD
GND
VDD
GND
VDD
9
8
GND
VDD
CMD
VDD
GND
GNDa GNDa
VDD
VDD
7
VDD
DQA8 DQA7 DQA5 DQA3 DQA1 CTMN CTM
RQ7
6
5
4
GND
GND
DQA6 DQA4 DQA2 DQA0
CFM
CFMN
RQ6
3
VDD
GND
SCK
VCMOS
GND
VDD
GND
VDDa
VREF
2
1
VDD
GND
GND
VDD
GND
ROW
ABCDE FGH J
COL
GND
RQ5
RQ4
GND
K
GND
RQ3
RQ2
VDD
L
VDD
VDD
VDD
GND
VDD
VDD
VDD
GND
GND
VCMOS
VDD
GND
RQ1
DQB1 DQB3 DQB5 DQB7 DQB8
VDD
RQ0
DQB0 DQB2 DQB4 DQB6
GND
GND
GND
GND
VDD
SIO0
SIO1
GND
VDD
GND
GND
GND
GND
VDD
MN
P
R
S
T
U
SAMSUNG 320
K4R761869A- xCxx
The pin #1(ROW 1, COL A) is located at the
A1 position on the top side and the A1 position
is marked by the marker â â.
Top View
Chip
Page 2
Version 1.41 Jan. 2004
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