K4R761869A-F Datasheet, PDF (20/20 Pages) Samsung semiconductor – 576Mbit RDRAM (A-die) 1M x 18bit x 32s banks Direct RDRAMTM

K4R761869A
Direct RDRAM^™
Center-Bonded WBGA Package
(92balls)
Figure 4 shows the form and dimensions of the recom-
mended package for the 92balls center-bonded WBGA
device class.
D
A B C D E F GH J K LMN P R S T U
Bottom
Bottom
Top
1
2
3
4
5
6
7
8
9
10
d
A
e2
e1
Bottom
E1
Figure 4: Center-Bonded WBGA Package
Table 19 lists the numerical values corresponding to dimen-
sions shown in Figure 4.
Table 19 : Center-Bonded WBGA Package Dimensions
Symbol
e1
e2
A
D
E
E1
d
Parameter
Ball pitch (x-axis)
Ball pitch (y-axis)
Package body length
Package body width
Package total thickness
Ball height
Ball diameter
Min.
0.80
0.80
13.3
15.0
0.90
0.30
0.40
Max.
0.80
0.80
13.5
15.2
1.00
0.40
0.50
E
Unit
mm
mm
mm
mm
mm
mm
mm
Page 18
Version 1.41 Jan. 2004