HYS72T64400HFD Datasheet, PDF (35/42 Pages) Qimonda AG – 240-Pin Fully-Buffered DDR2 SDRAM Modules

Internet Data Sheet
HYS72T[64/128/256]4[00/20]HFD–[3S/3.7]–A
7
Package Outline
All Components are surface mounted on one or both sides of
the PCB and positioned on the PCB to meet the minimum and
maximum trace lengths required for DDR2 SDRAM signals.
Bypass capacitors for DDR2 SDRAM devices are located
near the device power pins. The AMB device in the center of
the DIMM has a metal Heat Sink. The FB-DIMM mechanical
outlines are consistent with JEDEC MO-256.
JEDEC Raw Card PCB
Dimensions
TABLE 18
Raw Card Reference
Width [mm] Height [mm] Thickness [mm]
Note
R/C A
L-DIM-240-21 Figure 4 133.35
30.35
8.2
1)
R/C B
L-DIM-240-22 Figure 5 133.35
30.35
8.2
1)
R/C H
L-DIM-240-25 Figure 6 133.35
30.35
8.2
1)
1) Thickness includes Qimonda Heat Sink. Some early production modules with Jedec Heatspreader may be thicker up to 8.2mm.
Attention: Heat Sink heat up during operation. When unplugging a DIMM from a system direct skin contact should be
avoided until the Heat Sink has reached room temperature.
Attention: The Heat Sink is mechanically loaded. Do not remove. Removal of the clip may cause injuries.
Attention: Any mechanical stress on the Heat Sink should be avoided. Touching the Heat Sink while plugging or
unplugging the module may permanently damage the DIMM.
Rev. 1.2, 2006-11
35
03292006-GUME-ERC3