HYB25D512800BT Datasheet, PDF (33/38 Pages) Infineon Technologies AG – 512Mbit Double Data Rate SDRAM

Internet Data Sheet
HYB25D512[40/16/80]0B[E/F/C/T](L)
Double-Data-Rate SDRAM
5
Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly:
• P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
Description
Ball Size
Recommended Landing Pad
Recommended Solder Mask
TABLE 23
TFBGA Common Package Properties (non-green/green)
Size
Units
0.460
mm
0.350
mm
0.450
mm
• P-TSOPII: Plastic Thin Small Outline Package Type II
FIGURE 4
Package Outline of P-TFBGA-60-[9/22] (green/non-green)
12
11 x 1 = 11
1
0.18 MAX.
0.2
2)
B
1) 5)
2)
A
4)
3)
ø0.46 ±0.05
0.1 C
0.1 C
60x
ø0.15 M
ø0.08 M
C
A
B
C SEATING PLANE
1) Dummy Pads without Ball
2) Middle of Packages Edges
3) Package Orientation Mark A1
4) Bad Unit Marking (BUM)
5) Die Sort Fiducial
GPA09554
Rev. 1.63, 2006-09
33
03062006-PFFJ-YJY2