TDA8757 Datasheet, PDF (32/37 Pages) NXP Semiconductors – Triple 8-bit ADC 170 Msps

Philips Semiconductors
TDA8757
Triple 8-bit ADC 170 Msps
14. Package outline
HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads;
body 20 x 20 x 1.4 mm; exposed die pad
SOT612-1
c
y
X
Dh
A
108
73
109
72
ZE
e
Eh
144
1
pin 1 index
wM
e
bp
D
HD
E ^HE
wM
b_p
37
36
ZD
vM A
B
vM B
A ^A2
A₁
detail X
(A ₃)
θ
L_p
L
0
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c D⁽¹⁾ Dh E⁽¹⁾ Eh
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
7.1
6.9
20.1
19.9
7.1
6.9
5
scale
10 mm
e HD HE L
0.5
22.15 22.15
21.85 21.85
1
Lp
v
w
y ZD⁽¹⁾ ZE⁽¹⁾ θ
0.75
0.45
0.2
0.08 0.08
1.4
1.1
1.4
1.1
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT612-1
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
00-03-22
02-01-25
Fig 17. Package outline.
9397 750 09457
Preliminary data
Rev. 07 — 28 February 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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