TDA8020HL Datasheet, PDF (19/24 Pages) NXP Semiconductors – Dual smart card interface

Philips Semiconductors
Dual smart card interface
PACKAGE OUTLINE
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
Product specification
TDA8020HL
SOT358-1
c
y
X
24
25
17
A
16 Z _E
32
1
e
pin 1 index
wM
b_p
D
HD
e
wM
b_p
E ^HE
9
8
ZD
vM A
B
vM B
A ^A2 _A1
detail X
(A ₃)
θ
L_p
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A₁ A₂ A₃ b_p
c
D⁽¹⁾ E⁽¹⁾ e
H_D H_E L
L_p
v
w
y Z_D ⁽¹⁾ Z_E ⁽¹⁾ θ
mm
1.60
0.20
0.05
1.45
1.35
0.25
0.4
0.3
0.18
0.12
7.1
6.9
7.1
6.9
0.8
9.15 9.15
8.85 8.85
1.0
0.75
0.45
0.2
0.25
0.1
0.9
0.5
0.9
0.5
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT358 -1
IEC
136E03
REFERENCES
JEDEC
EIAJ
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
00-01-19
2001 Aug 15
19