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TDA8020HL Datasheet, PDF (13/24 Pages) NXP Semiconductors – Dual smart card interface | |||
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Philips Semiconductors
Dual smart card interface
Product speciï¬cation
TDA8020HL
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth(j-a)
thermal resistance from junction to ambient in free air
VALUE
80
UNIT
K/W
CHARACTERISTICS
VDD = 3.3 V; VDDI = 1.5 V; fCLKIN1 = fCLKIN2 = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise speciï¬ed.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX.
Temperature
Tamb
ambient temperature
â25
Supply
VDD
supply voltage on pins VDD
2.5
and VDDA
IDD
supply current (IDD and IDDA) inactive mode
â
Power-down mode; 2 cards
â
activated; VCC1 = VCC2 = 5 V;
ICC1 = ICC2 = 100 µA; CLK1 and
CLK2 stopped
active mode; VCC1 = VCC2 = 5 V; â
ICC1 + ICC2 = 80 mA;
CLK1 = CLK2 = 5 MHz
active mode; VCC1 = VCC2 = 3 V; â
ICC1 = ICC2 = 10 mA;
CLK1 = CLK2 = 5 MHz
VDDI
supply voltage for interface
1.5
signals
IDDI
supply current for interface
â
signals
Vth1
threshold voltage on VDD
falling
2.1
Vhys1
hysteresis on Vth1
50
Vth2
threshold voltage on
â
pin CDEL
VCDEL
voltage on pin CDEL
â
ICDEL
output current at pin CDEL pin grounded (charge)
â
VCDEL = VDD (discharge)
â
tW
width of the internal ALARM CDEL = 22 nF
â
pulse
â
+85
â
6.5
â
150
â
2.5
â
400
â
80
â
VDD
â
120
â
2.4
â
100
1.38 â
â
VDD + 0.3
â2
â
5
â
10
â
DC/DC converter
fint
internal oscillator frequency
VUP
voltage on pin VUP
at least one 5 V card
both cards 3 V
Vdt
detection voltage for doubler,
tripler and follower selection
2
2.5 3
â
5.5 â
â
4
â
â
3.4 â
UNIT
°C
V
µA
mA
mA
mA
V
µA
V
mV
V
V
µA
mA
ms
MHz
V
V
V
2001 Aug 15
13
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