 English |
|
|
|
|
|
|
|
| PSMN1R0-30YLC_15 Datasheet, PDF (11/14 Pages) NXP Semiconductors – N-channel 30 V 1.15 mΩ logic level MOSFET in LFPAK using NextPower technology | |||
| |||
| ◁ |
NXP Semiconductors
PSMN1R0-30YLC
N-channel 30 V 1.15 m⦠logic level MOSFET in LFPAK using
NextPower technology
11. Package outline
Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads
SOT669
L1
HD
E
A
A2
C
b2
c2
E1
mounting
base
b3
b4
D1
L2
1
2
3
4
e
b
wA
1/2 e
X
c
A
A1 C
detail X
(A3)
q
L
yC
0
5 mm
θ
scale
8°
0°
Dimensions (mm are the original dimensions)
Unit(1)
A A1 A2 A3 b b2 b3 b4
c
c2 D(1) D1(1) E(1) E1(1) e
H
L L1
max 1.20 0.15 1.10
0.50 4.41 2.2
mm nom
0.25
min 1.01 0.00 0.95
0.35 3.62 2.0
0.9 0.25 0.30 4.10 4.20 5.0
0.7 0.19 0.24 3.80
4.8
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
3.3
6.2 0.85 1.3
1.27
3.1
5.8 0.40 0.8
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT669
MO-235
L2 w y
1.3
0.25 0.1
0.8
sot669_po
Issue date
11-03-25
13-02-27
Fig. 19. Package outline LFPAK56; Power-SO8 (SOT669)
PSMN1R0-30YLC
Product data sheet
All information provided in this document is subject to legal disclaimers.
15 January 2015
© NXP Semiconductors N.V. 2015. All rights reserved
11 / 14
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese