PSMN020-30MLC_15 Datasheet, PDF (10/13 Pages) NXP Semiconductors – N-channel 30 V 18.1 mΩ logic level MOSFET in LFPAK33 using TrenchMOS Technology

NXP Semiconductors
PSMN020-30MLC
N-channel 30 V 18.1 mΩ logic level MOSFET in LFPAK33 using
TrenchMOS Technology
7. Package outline
Plastic single ended surface mounted package (LFPAK33); 8 leads
SOT1210
E
A
A
e₁
L
b₁
c₁
E₁
D
H
mounting
base
D₁
1
4
e
b
wA
X
A_{1 C}
Lp
detail X
c
θ
yC
Dimensions
0
2.5
5 mm
scale
Unit⁽¹⁾
A A₁ b b₁ c
c₁ D⁽¹⁾ D₁ E⁽¹⁾ E₁ e e₁ H
L L_p w
y
θ
max 0.90 0.10 0.35 0.35 0.20 0.30 2.70 2.35 3.40 2.45
3.40 0.25 0.50
8^°
mm nom
0.65 0.65
0.20 0.10
min 0.80 0.00 0.25 0.25 0.10 0.20 2.50 1.90 3.20 2.00
3.20 0.13 0.30
0^°
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT1210
Fig. 17. Package outline LFPAK33 (SOT1210)
sot1210_po
Issue date
11-12-19
12-03-12
PSMN020-30MLC
Product data sheet
All information provided in this document is subject to legal disclaimers.
4 September 2012
© NXP B.V. 2012. All rights reserved
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