MN101C115 Datasheet, PDF (39/170 Pages) Panasonic Semiconductor – Request for your special attention and precautions in using the technical information and semiconductors described in this book

Chapter 1 Overview
Package code: QFP044-P-1010
Unit: mm
Body Material: Epoxy Resin Lead Material:Fe Ni Lead Finish Method:Soldering dip
Figure 1-7-2 44-QFP
The external dimensions of the package are subject to change. Before
using this product, please obtain product specifications from the sales
office.
External Dimensions)
25