NT3H2111 Datasheet, PDF (70/77 Pages) NXP Semiconductors – Designed to be the perfect enabler for NFC in home-automation

NXP Semiconductors
NT3H2111/NT3H2211
NFC Forum Type 2 Tag compliant IC with I²C interface
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
1
e
4
bp
wM
A2 _A1
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ E⁽²⁾
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT505-1
v
w
y
Z⁽¹⁾
θ
0.1
0.1
0.1
0.70
0.35
6°
0°
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
Fig 32. Package outline SOT505-1 (TSSOP8)
NT3H2111/NT3H2211
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 3 February 2016
359930
© NXP Semiconductors N.V. 2016. All rights reserved.
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