NT3H2111 Datasheet, PDF (69/77 Pages) NXP Semiconductors – Designed to be the perfect enabler for NFC in home-automation

NXP Semiconductors
NT3H2111/NT3H2211
NFC Forum Type 2 Tag compliant IC with I²C interface
14. Package outline
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-3
X
D
terminal 1
index area
BA
E
A
A₁
detail X
L
3
2
1
terminal 1
index area
e
e
4
v CAB
wC
b
5
e₁
6
e₁
7
8
metal area
not for soldering
y₁ C
C
y
Dimensions
0
1
2 mm
scale
Unit
A A₁ b D E e e₁ L v w y y₁
max 0.5 0.05 0.25 1.65 1.65
mm nom
0.20 1.60 1.60 0.6
min
0.00 0.15 1.55 1.55
0.45
0.5 0.40 0.1 0.05 0.05 0.05
0.35
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
SOT902-3
---
MO-255
---
Fig 31. Package outline SOT902-3 (XQFN8)
NT3H2111/NT3H2211
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 3 February 2016
359930
European
projection
sot902-3_po
Issue date
11-08-16
11-08-18
© NXP Semiconductors N.V. 2016. All rights reserved.
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