NT3H2111 Datasheet, PDF (5/77 Pages) NXP Semiconductors – Designed to be the perfect enabler for NFC in home-automation

NXP Semiconductors
NT3H2111/NT3H2211
NFC Forum Type 2 Tag compliant IC with I²C interface
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
Version
NT3H2111W0FHK XQFN8
Plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x SOT902-3
1.6 x 0.6 mm; 1k bytes memory, 50pF input capacitance
NT3H2211W0FHK XQFN8
Plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x SOT902-3
1.6 x 0.6 mm; 2k bytes memory, 50pF input capacitance
NT3H2111W0FTT TSSOP8
Plastic thin shrink small outline package; 8 leads; body width 3 mm; 1k
bytes memory; 50pF input capacitance
SOT505-1
NT3H2211W0FTT TSSOP8
Plastic thin shrink small outline package; 8 leads; body width 3 mm; 2k
bytes memory; 50pF input capacitance
SOT505-1
NT3H2111W0FT1 SO8
Plastic small outline package; 8 leads; body width 3.9 mm, 1k bytes
memory; 50pF input capacitance
SOT96-1
NT3H2211W0FT1 SO8
Plastic small outline package; 8 leads; body width 3.9 mm, 2k bytes
memory; 50pF input capacitance
SOT96-1
NT3H2111W0FUG FFC
bumped
8 inch wafer, 150um thickness, on film frame carrier, electronic fail die
-
marking according to SECS-II format), Au bumps, 1k Bytes memory, 50pF
input capacitance
NT3H2211W0FUG FFC
bumped
8 inch wafer, 150um thickness, on film frame carrier, electronic fail die
-
marking according to SECS-II format), Au bumps, 2k Bytes memory, 50pF
input capacitance
5. Marking
Table 2. Marking codes
Type number
NT3H2111FHK
NT3H2211FHK
NT3H2111W0FTT
NT3H2211W0FTT
NT3H2111W0FT1
NT3H2211W0FT1
Line 1
211
221
32111
32211
NT32111
NT32211
Marking code
Line 2
-
-
DBSN ASID
DBSN ASID
DBSN ASID
DBSN ASID
Line 3
-
-
yww
yww
nDyww
nDyww
NT3H2111/NT3H2211
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 3 February 2016
359930
© NXP Semiconductors N.V. 2016. All rights reserved.
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