TDA8295_09 Datasheet, PDF (57/83 Pages) NXP Semiconductors – Digital global standard low IF demodulator for analog TV and FM radio

NXP Semiconductors
TDA8295
Digital global standard low IF demodulator for analog TV and FM radio
10. Limiting values
Table 70. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).^[1][2]
Symbol
Parameter
Conditions
V_DDDC(1V2)
V_{DDA(ADC)(3V3)}
V_{DDA(PLL)(1V2)}
V_{DDA(OSC)(1V2)}
V_i
core digital supply voltage (1.2 V)
ADC analog supply voltage (3.3 V)
PLL analog supply voltage (1.2 V)
oscillator analog supply voltage (1.2 V)
input voltage
pins IF_POS and IF_NEG
digital input pins (5 V tolerant)
pin XIN
T_lead
P_tot
T_stg
T_j
T_amb
V_esd
lead temperature
total power dissipation
storage temperature
junction temperature
ambient temperature
electrostatic discharge voltage
T_amb = 70 °C
pins SDA, SCL, SADDR0 and
SADDR1; machine model
all other pins; machine model
Min
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−40
-
−20
[3] _-
[4] _-
Max
Unit
+1.7
V
+4.6
V
+1.7
V
+1.7
V
+1.7
V
+5.1
V
+1.7
V
300
°C
0.5
W
+125 °C
125
°C
+85
°C
±150 V
±200 V
[1] Stresses above the absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
[2] The maximum allowed ambient temperature T_amb depends on the assembly condition of the package and especially on the design of
the PCB. The application mounting must be done in such a way that the maximum junction temperature T_j(max) is never exceeded.
[3] Class A according to EIA/JESD22-A115.
[4] Class B according to EIA/JESD22-A115.
11. Thermal characteristics
Table 71.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
ambient
Conditions
in still air
Typ
Unit
33
K/W
The thermal resistance depends strongly on the nature of the PCB used in the application
and on its design. The thermal resistance given in Table 71 corresponds to the value that
can be measured on a multilayer PCB (4 layers) as defined by EIA/JESD51-2. This value
is given for information only.
The junction temperature influences strongly the reliability of an IC. The PCB used in the
application contributes on a large part to the overall thermal characteristic. It must
therefore be designed to insure that the junction temperature of the IC never exceeds
T_j(max) = 125 °C at the maximum ambient temperature.
The IC has to be soldered to ground with its die-attached paddle. Plenty of vias are
recommended to remove the heat.
TDA8295_C2_2
Product data sheet
Rev. 02 — 27 November 2009
© NXP B.V. 2009. All rights reserved.
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