UPD784915B Datasheet, PDF (78/86 Pages) NEC – 16-BIT SINGLE-CHIP MICROCONTROLLERS

µPD784915B, 784916B
8. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD784915B and 784916B.
For details of the recommended soldering conditions, refer to the NEC document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 18-1. Soldering Conditions for Surface-Mount Type
µPD784915BGF-×××-3BA : 100-pin plastic QFP (14 × 20 mm)
µPD784916BGF-×××-3BA : 100-pin plastic QFP (14 × 20 mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Package peak temperature: 235°C, Duration: 30 sec. max.
(at 210°C or above), Number of times: 3 times max.
Package peak temperature: 215°C, Duration: 40 sec. max.
(at 200°C or above), Number of times: 3 times max.
Solder bath temperature: 260°C max. Duration: 10 sec. max.
Number of times: Once
Preliminary heat temperature: 120°C max.
(Package surface temperature)
Pin temperature: 300°C max.,
Duration: 3 sec. max. (per pin row)
Recommended
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
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