N25Q032A13ESE40F Datasheet, PDF (81/82 Pages) Micron Technology – SPI-compatible serial bus interface

32Mb, 3V, Multiple I/O Serial Flash Memory
Part Number Ordering Information
Table 40: Package Details (Continued)
Micron SPI
and JEDEC
Package
Name
V-PDFN-8
6mm x 5mm
V-PDFN-8
8mm x 6mm
T-PBGA-
24b05/6mm x
8mm
SOP2-8/
150 mil
Shortened
Package
Name
DFN/6mm x
5mm
DFN/8mm x
6mm
TBGA 24
Package Description
Very thin, plastic small-out-
line, 8 terminal pads (no
leads), 6mm x 5mm
Very thin, plastic small out-
line, 8 terminal pads (no
leads), 8mm x 6mm
Thin plastic ball grid array, 24
balls, 6mm x 8mm
SO8N
Small-outline integrated cir-
cuit, 8 pins, narrow (150 mils)
SOP2-16/
300 mil
SOP2-8/
208 mil
SO16W
SO8W
Small-outline integrated cir-
cuit, 16 pins, wide (300 mil)
Small-outline integrated cir-
cuit, 8 pins, wide (208 mil)
M25P
M45PE
Symbol
MP
ME
ZM
MN
MF
MW
N25Q
Symbol
F6
F8
M25P
M45PE Pack-
age Names
MLP8, DFN8,
VDFPN8,
VFQFPN8
MLP8, VDFPN8
Alternate
Package Name
V-PSON1-8/6mm
x 5mm, VSON
V-PSON1-8/8mm
x 6mm, VSON
12
TBGA24 6mm x
–
8mm
SC
SO8N SO8
SOIC-8/150 mil
narrow 150 mil
body width
SF
SO16 wide 300 SOIC-16/300 mil,
mil body width SOP 16L 300 mil
SE
SO8 wide 208 SOIC-8/208 mil,
mil body width SOP 8L 200 mil
PDF: 09005aef84566622
n25q_32mb_3v_65nm.pdf - Rev. G 9/12 EN
81
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