English
Language : 

MT41J128M16HA-15EDTR Datasheet, PDF (115/211 Pages) Micron Technology – DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 Banks MT41J256M8 – 32 Meg x 8 x 8 Banks MT41J128M16 – 16 Meg x 16 x 8 Banks
2Gb: x4, x8, x16 DDR3 SDRAM
Commands – Truth Tables
Table 71: Truth Table – CKE
Notes 1–2 apply to the entire table; see Table 70 (page 113) for additional command details
CKE
Previous Cycle4 Present Cycle4
Command5
Current State3
(n - 1)
(n)
(RAS#, CAS#, WE#, CS#)
Action5
Power-down
L
L
“Don’t Care”
Maintain power-down
L
H
DES or NOP
Power-down exit
Self refresh
L
L
“Don’t Care”
Maintain self refresh
L
H
DES or NOP
Self refresh exit
Bank(s) active
H
L
DES or NOP
Active power-down entry
Reading
H
L
DES or NOP
Power-down entry
Writing
H
L
DES or NOP
Power-down entry
Precharging
H
L
DES or NOP
Power-down entry
Refreshing
H
L
DES or NOP
Precharge power-down entry
All banks idle
H
L
DES or NOP
Precharge power-down entry
H
L
REFRESH
Self refresh
Notes
6
Notes:
1. All states and sequences not shown are illegal or reserved unless explicitly described
elsewhere in this document.
2. tCKE (MIN) means CKE must be registered at multiple consecutive positive clock edges.
CKE must remain at the valid input level the entire time it takes to achieve the required
number of registration clocks. Thus, after any CKE transition, CKE may not transition
from its valid level during the time period of tIS + tCKE (MIN) + tIH.
3. Current state = The state of the DRAM immediately prior to clock edge n.
4. CKE (n) is the logic state of CKE at clock edge n; CKE (n - 1) was the state of CKE at the
previous clock edge.
5. COMMAND is the command registered at the clock edge (must be a legal command as
defined in Table 70 (page 113)). Action is a result of COMMAND. ODT does not affect
the states described in this table and is not listed.
6. Idle state = All banks are closed, no data bursts are in progress, CKE is HIGH, and all tim-
ings from previous operations are satisfied. All self refresh exit and power-down exit pa-
rameters are also satisfied.
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN
115
Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2006 Micron Technology, Inc. All rights reserved.