PIC16F72-E Datasheet, PDF (92/136 Pages) Microchip Technology – 28-Pin, 8-Bit CMOS FLASH Microcontoller with A/D Converter

PIC16F72
14.1 DC Characteristics: PIC16F72 (Industrial, Extended)
PIC16LF72 (Industrial) (Continued)
PIC16LF72
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC16F72
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Sym
Characteristic
Min Typ† Max Units
Conditions
IDD Supply Current (Notes 2, 5)
D010
D010A
PIC16LF72 —
—
0.4 2.0 mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
25 48 μA LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D010
D013
PIC16F72 -
—
0.9 4 mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
5.2 15 mA HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D015* ΔIBOR Brown-out Reset Current —
(Note 6)
25 200 μA BOR enabled, VDD = 5.0V
IPD Power-down Current (Notes 3, 5)
D020
D021
PIC16LF72 —
—
2.0 30 μA VDD = 3.0V, WDT enabled, -40°C to +85°C
0.1 5 μA VDD = 3.0V, WDT disabled, -40°C to +85°C
D020
D021
PIC16F72 —
5.0 42 μA VDD = 4.0V, WDT enabled, -40°C to +85°C
0.1 19 μA VDD = 4.0V, WDT disabled, -40°C to +85°C
D023* ΔIBOR Brown-out Reset Current —
(Note 6)
25 200 μA BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption. The test conditions for all IDD measurements in active Operation mode
are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
5: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from
characterization and is for design guidance only. This is not tested.
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
DS39597C-page 90
© 2007 Microchip Technology Inc.