PIC16LF819-I Datasheet, PDF (162/176 Pages) Microchip Technology – Enhanced Flash Microcontrollers with nanoWatt Technology

PIC16F818/819
20-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
E
E1
p
B
n
D
2
1
c
A
A2
f
L
A1
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
Number of Pins
Pitch
n
20
p
.026
20
0.65
Overall Height
A
-
-
.079
-
-
Molded Package Thickness
A2
.065
.069
.073
1.65
1.75
Standoff
A1
.002
-
-
0.05
-
Overall Width
E
.291
.307
.323
7.40
7.80
Molded Package Width
E1
.197
.209
.220
5.00
5.30
Overall Length
D
.272
.283
.289
.295
7.20
Foot Length
L
.022
.030
.037
0.55
0.75
Lead Thickness
c
.004
-
.010
0.09
-
Foot Angle
f
0°
4°
8°
0°
4°
Lead Width
B
.009
-
.015
0.22
-
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
MAX
2.00
1.85
-
8.20
5.60
7.50
0.95
0.25
8°
0.38
JEDEC Equivalent: MO-150
Drawing No. C04-072
Revised 11/03/03
DS39598E-page 160
 2004 Microchip Technology Inc.