PIC16F628-20P Datasheet, PDF (132/170 Pages) Microchip Technology – FLASH-Based 8-Bit CMOS Microcontroller

PIC16F62X
17.1 DC Characteristics: PIC16F62X-04 (Commercial, Industrial, Extended)
PIC16F62X-20 (Commercial, Industrial, Extended)
PIC16LF62X-04 (Commercial, Industrial)
PIC16LF62X-04
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ Ta ≤ +85°C for industrial and
0°C ≤ Ta ≤ +70°C for commercial
PIC16F62X-04
PIC16F62X-20
(Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ Ta ≤ +85°C for industrial and
0°C ≤ Ta ≤ +70°C for commercial and
-40°C ≤ Ta ≤ +125°C for extended
Param
No.
Sym
Characteristic/Device
Min
Typ†
Max
Units
Conditions
VDD Supply Voltage
D001
PIC16LF62X 2.0
—
5.5
V
D001
PIC16F62X 3.0
—
5.5
V
D002
VDR RAM Data Retention
Voltage⁽¹⁾
—
1.5
—
V
Device in SLEEP mode*
D003
VPOR VDD Start Voltage
to ensure Power-on Reset
—
VSS
—
V
See section on Power-on Reset
for details
D004
SVDD VDD Rise Rate
to ensure Power-on Reset
0.05
—
—
V/ms See section on Power-on Reset
for details*
D005
VBOD Brown-out Detect Voltage
3.65
4.0
4.35
3.65
—
4.4
D010
D013
IDD Supply Current^{(2), (5)}
PIC16LF62X —
—
—
—
—
—
0.30
0.6
1.10
2.0
4.0
7.0
3.80
6.0
—
2.0
20
30
V
BODEN configuration bit is set
V
BODEN configuration bit is set,
Extended
mA Fosc = 4.0 MHz, VDD = 2.0⁽⁵⁾
mA FOSC = 4.0 MHz, VDD = 5.5*
mA Fosc = 20.0 MHz, VDD = 5.5
mA Fosc = 20.0 MHz, VDD = 4.5*
mA FOSC = 10.0 MHz, VDD = 3.0⁽⁶⁾
µA FOSC = 32 kHz, VDD = 2.0
D010
D013
D014
PIC16F62X —
—
—
—
—
0.60
0.7
1.10
2.0
4.0
7.0
3.80
6.0
—
2.0
20
30
mA Fosc = 4.0 MHz, VDD = 3.0
mA Fosc = 4.0 MHz, VDD = 5.5*
mA FOSC = 20.0 MHz, VDD = 5.5
mA FOSC = 20.0 MHz, VDD = 4.5*
mA FOSC = 10.0 MHz, VDD = 3.0*⁽⁶⁾
µA FOSC = 32 kHz, VDD = 3.0*
Legend: Rows with standard voltage device data only are shaded for improved readability.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active Operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
5: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2REXT (mA) with REXT in kΩ.
6: Commercial temperature only.
DS40300C-page 130
Preliminary
 2003 Microchip Technology Inc.