MAX11014 Datasheet, PDF (65/69 Pages) Maxim Integrated Products – Automatic RF MESFET Amplifier Drain-Current Controllers

CNVST
BUSY
INTERNALLY*
Automatic RF MESFET Amplifier
Drain-Current Controllers
tPUINT
tCNV11
tACQ11
INT REFERENCE POWERS UP IN 45μs
IDLE, BUT REFERENCE
STAYS POWERED UP
TEMPERATURE CONVERSION IN
30μs
IDLE, BUT REFERENCE
AND TEMPERATURE
SENSOR STAY
POWERED UP
END OF SCAN,
REFERENCE AND
TEMPERATURE SENSOR
POWER DOWN
AUTOMATICALLY
WRITE TO THE ADC
CONVERSION REGISTER TO
SET UP THE SCAN
CH5 LOADED
INTO THE FIFO
*ALL TIMING SPECIFICATIONS ARE TYPICAL.
CLOCK MODE TIMING EXAMPLE 2: COMMANDS A SCAN OF CHANNELS 5, 6, AND 10 WITH AN INTERNAL REFERENCE.
Figure 32. Clock Mode 11 Timing Example 2
CH6 (EXTERNAL
TEMPERATURE) RESULT
LOADED INTO THE FIFO
CH10 LOADED
INTO THE FIFO
Changing Clock Modes During ADC
Conversions
If the hardware configuration register’s CKSEL1 or
CKSEL0 bits are changed while the ADC is performing
a conversion (or series of conversions), the
MAX11014/MAX11015 reacts in one of three ways:
• CKSEL1/CKSEL0 = 00 and is then changed to
another value:
The ADC completes the already triggered series of
conversions and then goes idle. The BUSY output
remains high until the conversions are completed.
The MAX11014/MAX11015 then responds according
to commands with the new clock mode.
• CKSEL1/CKSEL0 = 01 and is then changed to
another value:
If waiting for the initial external trigger, the
MAX11014/MAX11015 immediately exit clock
mode 01, power down the ADC, and go idle.
If a conversion sequence is in progress, that conver-
sion is completed and then the ADC goes idle. The
BUSY output remains high until the conversions are
completed. The MAX11014/MAX11015 then respond
according to commands with the new clock mode.
• CKSEL1/CKSEL0 = 11 and is then changed to
another value:
If waiting for an external trigger, the MAX11014/
MAX11015 immediately exit clock mode 11, power
down the ADC, and go idle. The BUSY output
stays low and waits for the external trigger.
If a conversion sequence is in progress, that con-
version is completed and then the ADC goes idle.
Applications Information
Layout Considerations
For the external temperature sensor to perform to spec-
ifications, care must be taken to place the
MAX11014/MAX11015 as close as is practical to the
remote diode. Traces of DXP_ and DXN_ should not be
routed across noisy lines and buses. DXP_ and DXN_
routes should be guarded by ground traces on either
sides and should be routed over a quiet ground plane.
Traces should be wide enough (> 10mm) to lower
inductance, which tends to pick up radiated noise.
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