MAX11166 Datasheet, PDF (2/33 Pages) Maxim Integrated Products – 16-Bit, 500ksps/250ksps, ±5V SAR ADCs with Internal Reference in TDFN

MAX11166/MAX11167
16-Bit, 500ksps/250ksps, ±5V SAR ADCs
with Internal Reference in TDFN
Absolute Maximum Ratings
V_DD to GND.............................................................-0.3V to +6V
OVDD to GND........ -0.3V to the lower of (V_DD + 0.3V) and +6V
AIN+ to GND......................................................................... Q7V
AIN-, REF, REFIO, AGNDS
to GND................ -0.3V to the lower of (V_DD + 0.3V) and +6V
SCLK, DIN, DOUT, CNVST
to GND................ -0.3V to the lower of (V_DD + 0.3V) and +6V
Maximum Current into Any Pin...........................................50mA
Continuous Power Dissipation (T_A = +70NC)
TDFN (derate 18.2mW/NC above +70NC)...................1349mW
Operating Temperature Range............................ -40NC to +85NC
Junction Temperature.......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s)..................................+300NC
Soldering Temperature (reflow)........................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (q_JA).......59.3NC/W
Junction-to-Case Thermal Resistance (q_JC)............22.5NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V_DD = 4.75V to 5.25V, V_OVDD = 2.3V to 5.25V, f_SAMPLE = 500kHz or 250kHz, V_REF = 4.096V; T_A = T_MIN to T_MAX, unless otherwise
noted. Typical values are at T_A = +25NC.) (Note 2)
PARAMETER
ANALOG INPUT (Note 3)
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Input Voltage Range
AIN+ to AIN-, K = ^5.000
4.096
-K x V_REF
+K x V_REF
V
Absolute Input Voltage Range
Input Leakage Current
Input Capacitance
Input-Clamp Protection Current
DC ACCURACY (Note 4)
Resolution
No Missing Codes
Offset Error
Offset Temperature Coefficient
Gain Error
Gain Error Temperature
Coefficient
Integral Nonlinearity
Differential Nonlinearity
Positive Full-Scale Error
AIN+ to GND
AIN- to GND
Acquisition phase
Both inputs
N
INL
DNL
MAX11167, T_A = T_MIN to T_MAX
MAX11167, T_A = +25°C to +85°C
MAX11166, T_A = T_MIN to T_MAX
MAX11166, T_A = +25°C to +85°C
-(V_DD +
0.1)
+(V_DD +
0.1)
V
-0.1
+0.1
-10 +0.001 +10
µA
15
pF
-20
+20
mA
16
Bits
16
Bits
-1.5 ±0.1 +1.5
mV
±2.4
µV/°C
±2
±10
LSB
±1
ppm/°C
-2.0 ±0.5 +2.0
-1.0 ±0.5 +1.0
LSB
-2.4 ±0.5 +2.4
-1.5 ±0.5 +1.5
-0.5 ±0.2 +0.5 LSB
±14
LSB
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