LTC3786_15 Datasheet, PDF (32/34 Pages) Linear Technology – Low IQ Synchronous Boost Controller

LTC3786
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.70 ±0.05
3.50 ± 0.05
1.45 ± 0.05
2.10 ± 0.05 ^{(4 SIDES)}
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
0.40 ± 0.10
1
1.45 ± 0.10
2
(4-SIDES)
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UD16) QFN 0904
0.25 ± 0.05
0.50 BSC
3786fa
32