LTC3786_15 Datasheet, PDF (31/34 Pages) Linear Technology – Low IQ Synchronous Boost Controller

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3786
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev C)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ± 0.102
2.845 ± 0.102
(.112 ± .004)
0.889 ± 0.127
(.112 ± .004)
(.035 ± .005)
1
8
0.35
REF
5.23
(.206)
MIN
1.651 ± 0.102 3.20 – 3.45
(.065 ± .004) (.126 – .136)
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
1.651 ± 0.102
(.065 ± .004)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
16
9
4.039 ± 0.102
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
(.159 ± .004)
(NOTE 3)
0.280 ± 0.076
16151413121110 9 (.011 ± .003)
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1.10
(.043)
MAX
12345678
0.86
(.034)
REF
SEATING
PLANE _{0.17 – 0.27}
0.1016 ± 0.0508
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
(.007 – .011)
TYP
0.50
(.0197)
BSC
(.004 ± .002)
MSOP (MSE16) 0910 REV C
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3786fa
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