LTC3869-2_15 Datasheet, PDF(22/42 Page) Linear Technology – Dual, 2-Phase Synchronous Step-Down DC/DC Controllers

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LTC3869-2_15 Datasheet, PDF (22/42 Pages) Linear Technology – Dual, 2-Phase Synchronous Step-Down DC/DC Controllers

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LTC3869/LTC3869-2

Applications Information

For applications where the main input power is below 5V,

tie the VIN and INTVCC pins together and tie the combined

pins to the 5V input with a 1â¦ or 2.2â¦ resistor as shown

in Figure 7 to minimize the voltage drop caused by the

gate charge current. This will override the INTVCC linear

regulator and will prevent INTVCC from dropping too low

due to the dropout voltage. Make sure the INTVCC voltage

is at or exceeds the RDS(ON) test voltage for the MOSFET

which is typically 4.5V for logic level devices.

LTC3869 VIN

INTVCC

CINTVCC

4.7ÂµF

RVIN

1â¦

CIN

3869 F07

UVLO comparator constantly monitors the INTVCC voltage

to ensure that an adequate gate-drive voltage is present.

It locks out the switching action when INTVCC is below

3.2V. To prevent oscillation when there is a disturbance

on the INTVCC, the UVLO comparator has 600mV of preci-

sion hysteresis.

Another way to detect an undervoltage condition is to

monitor the VIN supply. Because the RUN pins have a

precision turn-on reference of 1.2V, one can use a resistor

divider to VIN to turn on the IC when VIN is high enough.

An extra 4.5ÂµA of current flows out of the RUN pin once

the RUN pin voltage passes 1.2V. One can program the

hysteresis of the run comparator by adjusting the values

of the resistive divider. For accurate VIN undervoltage

detection, VIN needs to be higher than 4.5V.

Figure 7. Setup for a 5V Input

CIN and COUT Selection

Topside MOSFET Driver Supply (CB, DB)

External bootstrap capacitors CB connected to the BOOST

pins supply the gate drive voltages for the topside MOS-

FETs. Capacitor CB in the Functional Diagram is charged

though external diode DB from INTVCC when the SW pin

is low. When one of the topside MOSFETs is to be turned

on, the driver places the CB voltage across the gate source

of the desired MOSFET. This enhances the MOSFET and

turns on the topside switch. The switch node voltage, SW,

rises to VIN and the BOOST pin follows. With the topside

MOSFET on, the boost voltage is above the input supply:

VBOOST = VIN + VINTVCC. The value of the boost capacitor

CB needs to be 100 times that of the total input capa-

citance of the topside MOSFET(s). The reverse break-

down of the external Schottky diode must be greater than

VIN(MAX). Make sure the diode is a low leakage diode even

at hot temperature to prevent leakage current feeding

INTVCC. When adjusting the gate drive level, the final arbiter

is the total input current for the regulator. If a change is

made and the input current decreases, then the efficiency

has improved. If there is no change in input current, then

there is no change in efficiency.

Undervoltage Lockout

The LTC3869 has two functions that help protect the

controller in case of undervoltage conditions. A precision

The selection of CIN is simplified by the 2-phase architec-

ture and its impact on the worst-case RMS current drawn

through the input network (battery/fuse/capacitor). It can

be shown that the worst-case capacitor RMS current oc-

curs when only one controller is operating. The controller

with the highest (VOUT)(IOUT) product needs to be used

in the formula below to determine the maximum RMS

capacitor current requirement. Increasing the output cur-

rent drawn from the other controller will actually decrease

the input RMS ripple current from its maximum value.

The out-of-phase technique typically reduces the input

capacitorâs RMS ripple current by a factor of 30% to 70%

when compared to a single phase power supply solution.

In continuous mode, the source current of the top MOSFET

is a square wave of duty cycle (VOUT)/(VIN). To prevent

large voltage transients, a low ESR capacitor sized for the

maximum RMS current of one channel must be used. The

maximum RMS capacitor current is given by:

CIN

Required

IRMS

IMAX

VIN

â¡â£(VOUT

) ( VIN

VOUT

)â¤â¦1/ 2

This formula has a maximum at VIN = 2VOUT, where IRMSâ¯=

IOUT/2. This simple worst-case condition is commonly used

for design because even significant deviations do not of-

fer much relief. Note that capacitor manufacturersâ ripple

current ratings are often based on only 2000 hours of life.

38692fa

For more information www.linear.com/LTC3869

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