ISL3874 Datasheet, PDF (33/33 Pages) Intersil Corporation – Wireless LAN Integrated Medium Access Controller with Baseband Processor with Mini-PCI

ISL3874
Plastic Ball Grid Array Packages (BGA)
o
A1
CORNER
A1
CORNER I.D.
A
D
E
B
TOP VIEW
0.15
0.006
MC
AB
0.08
0.003
MC
D1
A1
CORNER
b
S
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A1
CORNER I.D.
A
B
C
D
E
F
G
H E1
J
K
L
M
N
P
R
T
A1
A2
S
A
BOTTOM VIEW
e
ALL ROWS AND COLUMNS
bbb C
C
A
SIDE VIEW
aaa C
SEATING PLANE
V192.14x14
192 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.059
-
1.40
-
A1
0.012 0.016 0.31
0.41
-
A2
0.033 0.039 0.83
0.99
-
b
0.016 0.020 0.41
0.51
7
D/E
0.547 0.555 13.90 14.10
-
D1/E1 0.468 0.476 11.90 12.10
-
N
192
192
-
e
0.032 BSC
0.80 BSC
-
MD/ME
16 x 16
16 x 16
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
NOTES:
Rev. 1 1/01
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
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Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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