D2-7XX83_14 Datasheet, PDF (33/33 Pages) Intersil Corporation – Intelligent Digital Amplifier and Sound Processor

D2-7xx83
Low Plastic Quad Flatpack Packages (LQFP)
PIN 1
128
1
T
E
32
33
H
Y
SEATING PLANE
124X e
0.05
A ^A2
4X
0.2 Y T-U Z
D
Z
97
Q128.14x14
128 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE .4
MM PITCH
MILLIMETERS
SYMBOL MIN
NOM MAX NOTES
A
-
1.60
-
96
A1
0.05
0.15
-
A2
1.35
1.40
1.45
-
b
0.13
0.16
0.23
4
b1
0.13
-
0.19
-
U
E1
c
0.09
-
0.20
-
c1
0.09
-
0.16
-
D
16 BSC
-
D1
14 BSC
3
E
16 BSC
-
E1
14 BSC
3
L
0.45
0.60
0.75
-
65
L1
1.00 REF
-
R1
0.08
-
-
-
64
R2
0.08
-
0.20
-
D1
4X
0.2 H T-U Z
S
0.20
-
-
-
0
0°
3.5°
7°
-
01
0°
-
-
-
02
11°
12°
13°
-
DETAIL F
03
11°
12°
13°
-
N
128
-
e
0.40 BSC
-
128X b
0.080 Y
0.07 M Y T-U
b1
c
c1
02
PLATING
b
01
R1
R2
NOTES:
Rev. 1 7/11
1. Dimensions are in millimeters. Dimensions in ( ) for Refer-
ence Only.
2. Dimensions and tolerances per AMSEY14.5M-1994.
3. Dimensions D1 and E1 are excluding mold protrusion. Al-
lowable protrusion is 0.25 per side. Dimensions D1 and E1
are exclusive of mold mismatch and determined by datum
plane H.
4. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located at the lower radius or the foot. Minimum
space between protrusion and an adjacent lead is 0.07 mm.
03
A1
S
0
L
0.25 GAUGE
(L1)
PLANE
DETAIL F
33
FN7838.2
September 29, 2011