X28HC256_15 Datasheet, PDF (2/19 Pages) Intersil Corporation – 256k, 32k x 8-Bit, 5V, Byte Alterable EEPROM

X28HC256
Ordering Information
PART NUMBER
(Note 4)
PART MARKING
ACCESS TIME
(ns)
TEMP. RANGE
(°C)
PACKAGE
PKG. DWG. #
X28HC256JZ-15 (Notes 1, 3) X28HC256J-15 ZHY
150
0 to +70
32 Ld PLCC (RoHS Compliant)
N32.45x55
X28HC256JI-15 (Note 1)
X28HC256JI-15 HY
150
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-15
(Notes 1, 3)
X28HC256JI-15 ZHY
150
-40 to +85 32 Ld PLCC (RoHS Compliant)
N32.45x55
X28HC256PZ-15
(Notes 2, 3)
X28HC256P-15 HYZ
150
0 to +70
28 Ld PDIP (RoHS Compliant)
E28.6
X28HC256PIZ-15
(Notes 2, 3)
X28HC256PI-15 HYZ
150
-40 to +85 28 Ld PDIP (RoHS Compliant)
E28.6
X28HC256JZ-12 (Notes 1, 3) X28HC256J-12 ZHY
120
0 to +70
32 Ld PLCC (RoHS Compliant)
N32.45x55
X28HC256JI-12 (Note 1)
X28HC256JI-12 HY
120
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-12
(Notes 1, 3)
X28HC256JI-12 ZHY
120
-40 to +85 32 Ld PLCC (RoHS Compliant)
N32.45x55
X28HC256PZ-12
(Notes 2, 3)
X28HC256P-12 HYZ
120
0 to +70
28 Ld PDIP (RoHS Compliant)
E28.6
X28HC256PIZ-12
(Notes 2, 3)
X28HC256PI-12 HYZ
120
-40 to +85 28 Ld PDIP (RoHS Compliant)
E28.6
X28HC256SZ-12 (Note 3) X28HC256S-12 HYZ
120
0 to +70
28 Ld SOIC (300mils RoHS Compliant) MDP0027
X28HC256SI-12
X28HC256SI-12 HY
120
-40 to +85 28 Ld SOIC (300mils)
M28.3
X28HC256SIZ-12 (Note 3) X28HC256SI-12 HYZ
120
-40 to +85 28 Ld SOIC (300mils RoHS Compliant) MDP0027
X28HC256JZ-90 (Notes 1, 3) X28HC256J-90 ZHY
90
0 to +70
32 Ld PLCC (RoHS Compliant)
N32.45x55
X28HC256JI-90 (Note 1)
X28HC256JI-90 HY
90
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-90
(Notes 1, 3)
X28HC256JI-90 ZHY
90
-40 to +85 32 Ld PLCC (RoHS Compliant)
N32.45x55
X28HC256PZ-90
(Notes 2, 3)
X28HC256P-90 HYZ
90
0 to +70
28 Ld PDIP (RoHS Compliant)
E28.6
X28HC256PIZ-90 (Notes 2, 3) X28HC256PI-90 HYZ
90
-40 to +85 28 Ld PDIP (RoHS Compliant)
E28.6
X28HC256SI-90
X28HC256SI-90 HY
90
-40 to +85 28 Ld SOIC (300mils)
M28.3
X28HC256SIZ-90 (Note 3) X28HC256SI-90 HYZ
90
-40 to +85 28 Ld SOIC (300mils RoHS Compliant) MDP0027
NOTES:
1. Add “T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see product information page for X28HC256. For more information on MSL, please see tech brief TB363.
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FN8108.5
August 27, 2015