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ISL6333 Datasheet, PDF (13/40 Pages) Intersil Corporation – Three-Phase Buck PWM Controller with Integrated MOSFET Drivers and Light Load Efficiency Enhancements for Intel VR11.1 Applications
ISL6333, ISL6333A, ISL6333B, ISL6333C
Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Supply Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +15V
Absolute BOOT Voltage, VBOOT . . . . . . . GND - 0.3V to GND + 36V
PHASE Voltage, VPHASE . . . . . . . . . GND - 8V (<400ns, 20µJ) to 30V
(<200ns, VBOOT - VGND < 36V)
UGATE Voltage, VUGATE. . . . . . . . VPHASE - 0.3V to VBOOT + 0.3V
VPHASE - 3.5V (<100ns Pulse Width, 2µJ) to VBOOT + 0.3V
LGATE Voltage, VLGATE . . . . . . . . . . . GND - 0.3V to PVCC + 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to PVCC + 0.3V
Input, Output, or I/O Voltage . . . . . . . . . GND - 0.3V to VCC + 0.3V
Thermal Information
Thermal Resistance
θJA (°C/W) θJC (°C/W)
QFN Package (Notes 1, 2) . . . . . . . . . .
28
1.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
VCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+5V ±5%
PVCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . +5V to 12V ±5%
Ambient Temperature
ISL6333CRZ, ISL6333ACRZ, ISL6333BCRZ,
ISL6333CCRZ . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL6333IRZ, ISL6333AIRZ, ISL6333BIRZ,
ISL6333CIRZ . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions. Boldface limits apply over the operating temperature range.
PARAMETER
TEST CONDITIONS
MIN
MAX
(Note 4)
TYP
(Note 4)
BIAS SUPPLIES
Input Bias Supply Current
Lower Gate Drive Bias Current -
PVCC1 Pin
IVCC; EN = high
IPVCC1; EN = high
13
16.7
19.5
0.7
1.8
4
Lower Gate Drive Bias Current -
PVCC2_3 Pin (ISL6333, ISL6333B
Only)
IPVCC2_3; EN = high
1.5
2.6
5
Lower Gate Drive Bias Current - PVCC3 IPVCC3; EN = high
Pin (ISL6333A, ISL6333C Only)
1.5
2.6
5
Upper Gate Drive Bias Current -
PUVCC Pin
IUVCC; EN = high
0.6
1
1.4
VCC POR (Power-On Reset) Threshold VCC rising
4.25
4.41
4.50
VCC falling
3.75
3.85
4.00
PVCC POR (Power-On Reset)
Threshold
PVCC1, PVCC2_3, PUVCC rising
PVCC1, PVCC2_3, PUVCC falling
4.30
4.42
4.55
3.70
3.83
3.95
BYP1 POR (Power-On Reset)
Threshold
BYP1 rising
BYP1 falling
4.20
4.40
4.55
3.70
3.80
3.90
PWM MODULATOR
Oscillator Frequency Accuracy, FSW
(ISL6333CRZ, ISL6333ACRZ,
ISL6333BCRZ, ISL6333CCRZ)
RT = 100kΩ (± 0.1%)
225
250
275
Oscillator Frequency Accuracy, FSW
(ISL6333IRZ, ISL6333AIRZ,
ISL6333BIRZ, ISL6333CIRZ)
RT = 100kΩ (± 0.1%)
(Note 3)
215
250
280
Adjustment Range of Switching
Frequency
(Note 3)
0.08
-
1.0
UNITS
mA
mA
mA
mA
mA
V
V
V
V
V
V
kHz
kHz
MHz
13
FN6520.3
October 8, 2010