82540EP Datasheet, PDF (34/46 Pages) Intel Corporation – 82540EP Gigabit Ethernet Controller

82540EP — Networking Silicon
5.2
Package Information
The 82540EP device is a 196-lead ball grid array (TFBGA) measuring 15 mm². The package
dimensions are detailed in Figure 11. The nominal ball pitch is 1 mm. .
Figure 11. Dimension Diagram for the 196-pin BGA
1.56 +/-0.19
0.85
30 ^o
0.32 +/-0.04
0.40 +/-0.10
Seating Plate
Note: All dimensions are in millimeters.
Substrate change from
0.36 mm to 0.32 mm
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
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