TLE8262-2E Datasheet, PDF (92/94 Pages) Infineon Technologies AG – Universal System Basis Chip

TLE8262-2E
17
Package Outline
Package Outline
0.65
C
17 x 0.65 = 11.05
0.1 C 36x
SEATING PLANE
0.33 ±0.08 ²⁾
36
0.17 M A-B C D 36x
A
19 _{Ejector Mark}
0.35 x 45˚
7.6 _-0.2 ¹⁾
0.7 ±0.2
10.3 ±0.3
D
Bottom View
19
36 _{Exposed Diepad}
1
18
B
12.8
1)
-0.2
Index Marking
18 _Ex 1 Index Marking
Exposed Diepad Dimensions ⁴⁾
Package
Leadframe Ex Ey
PG-DSO-36-24, -41, -42 A6901-C001 7 5.1
PG-DSO-36-38
A6901-C003 7 5.1
PG-DSO-36-38
A6901-C007 5.2 4.6
PG-DSO-36-50
A6901-C008 6.0 5.4
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Excluding the mold flash allowance of 0.3 max per side
PG-DSO-36-24, -38, -41, -42, -50-PO V09
Figure 47 PG-DSO-36-38 (Leadframe A6901-003);)
Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations, the Universal System Basis Chip is available as a green product. Green products are
RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-
020).
For information about packages and types of packing, refer to the
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
92
Dimensions in mm
Rev. 1.0, 2009-05-26