TLE8262-2E Datasheet, PDF (87/94 Pages) Infineon Technologies AG – Universal System Basis Chip

TLE8262-2E
Application Information
Note: This is a very simplified example of an application circuit and bill of material. The function must be verified
in the actual application.
Table 25 Bills of material
Ref. Option Vendor Value
Capacitance
C1
Y
C2
Y
Kemet
68µF optional depending on
application
100nF
C3
N
Murata 10µF ceramic cap low ESR
C5
N
1nF OEM dependent
C7
Y
22nF 50V
C8
Y
47nF OEM dependent
C9
Y
10µF
C10 N
C11 N
C12 Y
C13 Y
C14 Y
Resistance
R1
N
100nF
10µF CAN transceiver dependent
100nF
100nF
100nF
220mΩ
R3
Y
R5
Y
R7
Y
R8
Y
R9
Y
R10 Y
R12 Y
1kΩ / OEM dependent
1kΩ
60Ω / OEM dependent
60Ω / OEM dependent
10kΩ
500Ω
47kΩ
Purpose
Cut off battery spike
EMC
Stability of the V_CC3
LIN Master Termination
EMC
Improve SPLIT pin stability
Buffer of the V_CC1µC depending on load.
(µC)
Stability of the V_CC1µC
Buffering of the V_CC2 for CAN Transceiver
Improve stability of the logic
Improve stability of the logic
Improve stability of the logic
V_CC3 current measurement for I_CC3
400mA max
LIN master termination
Wetting current of the switch
CAN bus termination
CAN bus termination
Limit the WK pin current in ISO pulses
Insulation of the VDD supply
Set config 1/3. If not connected config 2/4
is selected
Data Sheet
87
Rev. 1.0, 2009-05-26