XC164KM Datasheet, PDF (60/62 Pages) Infineon Technologies AG – 16-Bit Single-Chip Microcontroller with C166SV2 Core

5
Package and Reliability
XC164KM
Derivatives
Package and Reliability
5.1
Packaging
Table 5-1 Package Parameters (PG-TQFP-64-8)
Parameter
Symbol
Limit Values
Min.
Max.
Power dissipation
P_DISS
–
0.6
Thermal resistance
R_THA
–
28
Package Outlines
Unit Notes
W
–
K/W Chip-Ambient
H
0.5
0.2
+0.07
-0.03
2)
C
7.5
0.08
0.08 M A-B D C 64x
12
10 ¹⁾
D
0.2 A-B D 4x
0.2 A-B D H 4x
A
B
0.6 ±0.15
64
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
2) Does not include dambar protrusion of 0.08 max. per side
Figure 5-1 PG-TQFP-64-8 (Plastic Thin Quad Flat Package)
You can find all of our packages, sorts of packing and others in our Infineon Internet
Page “Products”: http://www.infineon.com/products
Dimensions in mm.
Data Sheet
58
V1.0, 2005-11