HYB39L128160AC Datasheet, PDF (21/49 Pages) Infineon Technologies AG – 128-MBIT SYNCHRONOUS LOW-POWER DRAM

Package Outlines
HYB 39L128160AC/T
128-MBit 3.3V Mobile-RAM
Plastic Package, P-TSOPII-54
(400 mil, 0.8 mm lead pitch)
Thin Small Outline Package, SMD
15˚±5˚
0.8
0.35
+0.1 ³⁾
-0.05
15˚±5˚
26x 0.8 = 20.8
0.1 54x
0.2 M 54x
54
28
10.16±0.13 ²⁾
0.5 ±0.1
11.76 ±0.2
1 _{2.5 max}
27
22.22 ±0.13 ¹⁾
Index Marking
1) _{Does not include plastic or metal protrusion of 0.15 max per side}
2) _{Does not include plastic protrusion of 0.25 max per side}
3) _{Does not include dambar protrusion of 0.13 max per side}
GPX09039
INFINEON Technologies
21
2003-02