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HYS72V16300GR Datasheet, PDF (2/22 Pages) Infineon Technologies AG – PC133 Registered SDRAM-Modules
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HYS 72Vxx3xxGR
PC133 Registered SDRAM-Modules
Ordering Information
Partnumber 1)
Compliance
Code 2)
Description
SDRAM
Technology
PC133-333:
HYS 72V16300GR-7.5-C
HYS 72V16300GR-7.5-E
PC133R-333-542-B2 one bank 128 MB Reg. DIMM
64 MBit (x4)
HYS 72V16301GR-7.5-C2 PC133R-333-542-B2 one bank 128 MB Reg. DIMM
128 MBit (x8)
HYS 72V32301GR-7.5-C2 PC133R-333-542-B2 one bank 256 MB Reg. DIMM
128 Mbit (x4)
HYS 72V32300GR-7.5-C2
HYS 72V32300GR-7.5-D
PC133R-333-542-AA one bank 256 MB Reg. DIMM
256 Mbit (x8)
HYS 72V64300GR-7.5-C2
HYS 72V64300GR-7.5-D
PC133R-333-542-B2 one bank 512 MB Reg. DIMM
256 MBit (x4)
HYS 72V128320/1GR-7.5-C2 PC133R-333-542-B2 two banks 1 GByte Reg. DIMM
HYS 72V128320/1GR-7.5-D
256 MBit
(x4, stacked) 3)
HYS 72V128300GR-7.5-A PC133R-333-542-B2 one bank 1 GByte Reg. DIMM
512 MBit (x4)
HYS 72V256320/1GR-7.5-A PC133R-333-542-B2 two banks 2 GByte Reg. DIMM
512 MBit
(x4, stacked) 3)
PC133-222:
HYS 72V16300GR-7-E
PC133R-222-542-B2 one bank 128 MB Reg. DIMM
64 MBit (x4)
HYS 72V16301GR-7-C2
PC133R-222-542-B2 one bank 128 MB Reg. DIMM
128 MBit (x8)
HYS 72V32301GR-7-C2
PC133R-222-542-B2 one bank 256 MB Reg. DIMM
128 Mbit (x4)
HYS 72V32300GR-7-D
PC133R-222-542-AA one bank 256 MB Reg. DIMM
256 Mbit (x8)
HYS 72V64300GR-7-D
PC133R-222-542-B2 one bank 512 MB Reg. DIMM
256 MBit (x4)
HYS 72V128320/1GR-7-D PC133R-222-542-B2 two banks 1 GByte Reg. DIMM
256 MBit
(x4, stacked) 3)
HYS 72V128300GR-7-A
PC133R-222-542-B2 one bank 1 GByte Reg. DIMM
512 MBit (x4)
HYS 72V256320/1GR-7-A PC133R-222-542-B2 two banks 2 GByte Reg. DIMM
512 MBit
(x4, stacked) 3)
Notes:
1.) All part numbers end with a place code, designating the die revision of the components used on the
Registered DIMM module. Consult factory for current revision. Example: HYS 64V32300GR-7.5-D,
indicating Rev.D dies are used for 256Mbit SDRAM components.
2.) The Compliance Code is printed on the modules labels and describes speed sort of the modules,
latencies, access time from clock,SPD revision and Raw Card version acording to the actual JEDEC
standard.
3.) Modules with stacked components are available in two version, with components stacked using a
soldering stacking technique (f.e. HYS72V128320GR-7.5 ) and an welding technique developed by
INFINEON Technologies (f.e. HYS72V128321GR-7.5)
.
INFINEON Technologies
2
2002-07-18
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