TC1793 Datasheet, PDF (181/189 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller

TC1793
Electrical ParametersPackage and Reliability
5.5
Package and Reliability
5.5.1 Package Parameters
Table 47
Device
Thermal Characteristics of the Package
Package
RΘJCT RΘJCB RΘJA
1)
1)
Unit
Note
TC1793 PG-BGA- 416
3,3
4,5
12,1 K/W
1) The top and bottom thermal resistances between the case and the ambient (R_TCAT, R_TCAB) are to be combined
with the thermal resistances between the junction and the case given above (R_TJCT, R_TJCB), in order to calculate
the total thermal resistance between the junction and the ambient (R_TJA). The thermal resistances between
the case and the ambient (R_TCAT, R_TCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: T_J = T_A + R_TJA × P_D, where the R_TJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R_TJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ’cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
174
V 1.2, 2014-05