TLE8110EE_13 Datasheet, PDF (13/74 Pages) Infineon Technologies AG – Overvoltage, Overtemperature, ESD -Protection

TLE 8110 EE
Smart Multichannel Switch
General Product Characteristics
4.3
Thermal Resistance
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
4.3.1
4.3.2
Junction to Soldering Point
Junction to Ambient
R_thJSP
-
R_thJA
-
1.75 3.60
25.00 -
K/W
K/W
P_vtot = 3W¹⁾²⁾³⁾
P_vtot = 3W¹⁾²⁾³⁾
1) Not subject to production test, specified by design.
2) Homogenous power distribution over all channels (All Power stages equally heated), dependent on cooling set-up.
3) Refer to Figure 5
Dimensions : 76.2 x 114.3 x 1.5 mm³ , FR4
Metallization: JEDEC 2s2p (JESD 51-7) + (JESD 51-5)
Thermal Vias : Φ=0.3 mm; plating 25 µm; 24 pcs. for PG-DSO-36
70µm modeled (traces)
35µm, 90% metallization
35µm, 90% metallization
70µm, 5% metallization
Figure 5 PG-DSO-36 PCB set-up
Data Sheet
13
Rth PCB setup.vsd
Rev. 1.4, 2013-07-02