STAC9752 Datasheet, PDF (90/95 Pages) Integrated Device Technology – TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING

STAC9752/9753
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
15. SOLDER REFLOW PROFILE
15.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 ^oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
Profile Feature
Pb Free Assembly
Average Ramp-Up Rate (Ts_max - Tp)
Preheat
Temperature Min (Ts_min )
Temperature Max (Ts_max)
Time (ts_min - ts_max)
Time maintained above
Temperature (T_L)
Time (t_L)
Peak / Classification Temperature (Tp)
3 ^oC / second max
150 ^oC
200 ^oC
60 - 180 seconds
217 ^oC
60 - 150 seconds
See “Package Classification Reflow Temperatures” on page 91.
Time within 5 ^oC of actual Peak Temperature (tp) 20 - 40 seconds
Ramp-Down rate 6 ^oC / second max
Time 25 ^oC to Peak Temperature 8 minutes max
Note: All temperatures refer to topside of the package, measured on the package body surface.
Figure 25. Reflow Profile
IDT™
90
STAC9752/9753
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
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