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HAT3008RJ Datasheet, PDF (3/15 Pages) Hitachi Semiconductor – Silicon N/P Channel Power MOS FET High Speed Power Switching
HAT3008R/HAT3008RJ
Electrical Characteristics (Ta = 25°C)
( N Channel )
Item
Symbol Min
Drain to source breakdown voltage V(BR)DSS
Gate to source breakdown voltage V(BR)GSS
Gate to source leak current
I GSS
Zero gate voltage
HAT3008R IDSS
drain current
HAT3008RJ IDSS
Zero gate voltage
HAT3008R IDSS
drain current
HAT3008RJ IDSS
Gate to source cutoff voltage
VGS(off)
Static drain to source on state
RDS(on)
resistance
RDS(on)
Forward transfer admittance
|yfs|
Input capacitance
Ciss
60
± 20
—
—
—
—
—
1.2
—
—
6
—
Output capacitance
Coss —
Reverse transfer capacitance
Crss —
Turn-on delay time
t d(on)
—
Rise time
tr
—
Turn-off delay time
t d(off)
—
Fall time
tf
—
Body–drain diode forward voltage VDF
—
Typ Max Unit
—
—
V
—
—
V
—
± 10 µA
—
1
µA
—
0.1 µA
—
—
µA
—
10
µA
—
2.2 V
0.043 0.058 Ω
0.056 0.084 Ω
9
—
S
520 —
pF
270 —
pF
100 —
pF
11
—
ns
40
—
ns
110 —
ns
80
—
ns
0.84 1.1 V
Test Conditions
ID = 10 mA, VGS = 0
IG = ± 100 µA, VDS = 0
VGS = ± 16 V, VDS = 0
VDS = 60 V, VGS = 0
VDS = 48 V, VGS = 0
Ta = 125°C
VDS = 10 V, I D = 1 mA
ID = 3 A, VGS = 10 V Note4
ID = 3 A, VGS = 4 V Note4
ID = 3 A, VDS = 10 V Note4
VDS = 10 V
VGS = 0
f = 1MHz
VGS =10 V, ID = 3 A
VDD ≅ 30 V
IF = 5 A, VGS = 0 Note4
Body–drain diode reverse
recovery time
Note: 5. Pulse test
t rr
—
40 —
ns
IF =5 A, VGS = 0
diF/ dt = 50 A/µs
3