MB39C313 Datasheet, PDF (9/52 Pages) Fujitsu Component Limited. – 4ch System Power Management IC for LCD Panel

MB39C313
Gate Drive Pin (GD)
GD pin is an open drain output that triggers (pulls “Low”) after DLY2 expires and the voltage at FB pin rise
above 1.03 V (90 % of FB reference voltage, 1.146 V). 1.03 V at FB pin translates to 90 % of the regulation
point of the Boost converter. GD pin remains “Low” until the input voltage or voltage on EN2 is cycled to
ground.
VGL : Negative Charge Pump
The negative charge pump uses fixed switching frequency regulated architecture. The output voltage is set
externally by a resistor divider. The regulation is done by controlling the pump current in the driver. Refer to
the system block diagram, the charge pump use external diodes, pumping capacitor and output filter capac-
itor. Since the input of the charge pump and the driver is connected to the supply pin (VIN), the maximum
negative output voltage is -VIN + Vloss. Vloss includes voltage drop in external diodes and gate driver. Additional
charge pump stage can be added to generate larger negative voltage.
VGH : Positive Charge Pump
The positive charge pump uses fixed switching frequency regulated architecture. The output voltage is set
externally by a resistor divider. The regulation is done by controlling the pump current in the driver.
Refer to the system block diagram, the charge pump use external diodes, pumping capacitor and output
filter capacitor. The input of the charge pump is connected to the VS (Boost converter output) and the pump
capacitor is charged to VS during charging phase. As the supply to the driver (SUP pin) can be either the VS
(Boost converter output) or the VIN (supply PIN) of MB39C313, the maximum output voltage is VSUP + VS.
Additional charge pump stage can be added to increase the maximum output voltage.
Common Block
Under Voltage Lockout
MB39C313 will shutdown when the supply voltage below 6 V to prevent improper operation of the device.
Over Temperature Protection
When the junction temperature rises above 150 °C, most of the active circuitries are shutdown to prevent
damage from excessive power dissipation beyond safety limits.
DS04–27267–1E
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