MB39C313 Datasheet, PDF (47/52 Pages) Fujitsu Component Limited. – 4ch System Power Management IC for LCD Panel

MB39C313
■ PACKAGE DIMENSIONS
28-pin plastic TSSOP
(FPT-28P-M20)
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
0.65 mm
4.40 mm × 9.70 mm
Gullwing
Plastic mold
1.20 mm Max
0.12 g
28-pin plastic TSSOP
(FPT-28P-M20)
*9.70±0.10(.382±.004)
6.20(.244)
28
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) * : These dimensions do not include resin protrusion.
EXPOSED THERMAL PAD ZONE
0.155±0.025
(.0061±.0010)
15
INDEX
2.75
(.108)
6.40±0.20
(.252±.008)
*4.40±0.10
(.173±.004)
Details of "A" part
1.10
+0.10
–0.15
.043
+0.04
–0.06
(Mounting height)
1
0.65(.026)
0.24±0.08
(.009±.003)
14
0.13(.005) M
"A"
0~8°
0.10(.004)
0.10±0.05
(.004±.002)
(Stand off)
0.60±0.15
(.024±.006)
C _{2007-2009 FUJITSU MICROELECTRONICS LIMITED F28063S-c-1-4}
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
DS04–27267–1E
47