MB39C313 Datasheet, PDF (42/52 Pages) Fujitsu Component Limited. – 4ch System Power Management IC for LCD Panel

MB39C313
■ LAND PATTERN
The MB39C313 has an exposed thermal pad zone on the bottom side of the IC. This area has to be soldered
onto the PCB board to enhance heat dissipation.
The via should be placed in the thermal pad. These via assist heat dissipation towards the bottom layer of
the PCB. Via and copper pad size may be adjusted according to PCB constraints.
• Land pattern design example
0.65 mm
9.7 mm
6.46 mm
28 27 26 25 24 23 22 21 20 19 18 17 16 15
Via
Diameter = 0.3 mm
Soldemask
Opening
1 2 3 4 5 6 7 8 9 10 11 12 13 14
0.35 mm
1.3 mm
42
DS04–27267–1E