MB39C313 Datasheet, PDF (46/52 Pages) Fujitsu Component Limited. – 4ch System Power Management IC for LCD Panel

MB39C313
■ MB39C313PFTH RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL
[FUJITSU MICROELECTRONICS Recommended Mounting Conditions]
Item
Condition
Mounting Method
IR (infrared reflow), warm air reflow
Mounting times
2 times
Before opening
Please use it within two years after
manufacture.
Storage period
From opening to the 2nd reflow
When the storage period after opening
was exceeded
Less than 8 days
Please process within 8 days after baking
(125 °C ± 3 °C, 24hrs + 2H/-0H)
Baking can be performed up to two times.
Storage conditions
5 °C to 30 °C, 70%RH or less (the lowest possible humidity)
[Parameters for Each Mounting Method]
IR (infrared reflow)
260°C
255°C
170 °C
~
190 °C
RT
(b)
(c) (d)
(e)
(a)
(d')
H rank : 260 °C Max
(a) Temperature Increase gradient : Average 1 °C/s to 4 °C/s
(b) Preliminary heating
: Temperature 170 °C to 190 °C, 60s to 180s
(c) Temperature Increase gradient : Average 1 °C/s to 4 °C/s
(d) Actual heating
: Temperature 260 °C Max; 255 °C or more, 10s or less
(d’)
: Temperature 230 °C or more, 40s or less
or
Temperature 225 °C or more, 60s or less
or
Temperature 220 °C or more, 80s or less
(e) Cooling
: Natural cooling or forced cooling
Note : Temperature : the top of the package body
Manual soldering (partial heating method)
Item
Condition
Before opening
Within two years after manufacture.
Storage period
Between opening and mounting
Within two years after manufacture.
(No need to control moisture during the storage
period because of the partial heating method. )
Storage conditions
5 °C to 30 °C, 70%RH or less (the lowest possible humidity)
Mounting
conditions
Temperature at the tip of a soldering iron: 400 °C max
Time: Five seconds or below per pin*
* : Make sure that the tip of a soldering iron does not come in contact with the package body.
46
DS04–27267–1E