MB39C011APFT-G-BND-ERE1 Datasheet, PDF (51/53 Pages) Cypress Semiconductor – 2 ch DC/DC Converter IC with Synchronous Rectification

29. Package Dimensions
16-pin plastic TSSOP
(FPT-16P-M07)
16-pin plastic TSSOP
(FPT-16P-M07)
*¹ _{5.00±0.10(.197±.004)}
16
9
MB39C011A
Lead pitch
Package width ×
package length
Lead shape
0.65 mm
4.40 × 5.00 mm
Gullwing
Sealing method
Plastic mold
Mounting height
1.10mm MAX
Weight
Code
(Reference)
0.06g
P-TSSOP16-4.4×5.0-0.65
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.17±0.05
(.007±.002)
INDEX
*² _{4.40±0.10 6.40±0.20}
(.173±.004) (.252±.008)
LEAD No. 1
8
"A"
0.65(.026)
0.24±0.08
(.009±.003)
0.13(.005) M
0.10(.004)
©_C20₂0₀₀3₃-2_F0_U0_J8_ITSF_UUJ_LI_IT_MS_ITU_EDM_FIC₁₆R₀₂O_0SE_-L_c-E_3-C₃TRONICS LIMITED F16020S-c-3-4
Details of "A" part
1.05±0.05
(.041±.002)
(Mounting
height)
0~8˚
(0.50(.020))
0.60±0.15
(.024±.006)
0.07
+0.03
–0.07
.003
+.001
–.003
(Stand off)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Document Number: 002-08369 Rev. *A
Page 51 of 53